The Chomerics Division of Parker Hannifin introduces its CHO-MUTE 9009 microwave absorber material. Comprising a silicone elastomer matrix with a carbon filler, the material provides RF absorption performance at a high-frequency range. For

Parker Chomerics | 06-11-2023

The 14th generation Intel Core desktop processors of the K and KF series – codenamed 'Raptor Lake Refresh' – expand Rutronik's portfolio of high-end gaming equipment. The Intel Core processors offer the Intel Performance Hybrid architecture

Rutronik | 01-11-2023

SEGGER's flash programmer for authenticated off-site production protects the firmware image at all stages of the provisioning process between IP owner and contract manufacturer. TELP secures the link from programmer to target and assures th

Segger | 01-11-2023

Renesas Electronics Corporation has released a cost-effective IPS technology for highly accurate motor position sensor ICs for industrial, medical and robotics applications. Using non-contact coil sensors, the position sensing technology ca

Renesas | 31-10-2023

With DELO DUALBOND OB6799, DELO provides an adhesive optimised to fulfil the high optical needs of modern driver assistance systems. With it, the adhesive manufacturer sets new process speed and alignment accuracy standards for automotive c

DELO | 31-10-2023

Littelfuse, Inc. has released its latest innovative product, the 59001 Reed Sensor. This miniature D-shaped cylindrical reed sensor provides a compact size, high performance, and customisation options, making it an excellent choice for vari

Littelfuse | 30-10-2023

Cadence Design Systems, Inc. has expanded its Tensilica HiFi and Vision DSP families by introducing four new DSPs based on the recently announced Tensilica Xtensa LX8 processor platform. The new HiFi and Vision DSPs meet increasing system-l

Cadence | 30-10-2023

There is no way around automation if companies wish to stand their ground in the face of a shortage of skilled workers, tight margins and ever-shorter time-to-market. In this context, cameras are vital. IDS is hosting an online event, "Insi

IDS | 26-10-2023

CEA-Leti has announced a new R&D initiative to contribute to a higher level of vehicle automation and cooperation by extending the latest developments in vehicular wireless communications that enhance reaction time, pedestrian detection

CEA-Leti | 25-10-2023

Mouser will be organising a free workshop to help engineers developing IoT applications to accelerate their projects with secure IoT cloud deployment. The company has partnered with Würth Elektronik to hold a limited space 'Build A Secure R

Mouser Electronics | 24-10-2023

Melexis has expanded its MLX9042x series of 3D magnetic position sensing solutions with the MLX90423. This new device blends high accuracy for long strokes (up to 30mm), stray field immunity and ISO26262 (supports up to ASIL D system integr

Melexis | 24-10-2023

DELO has created a flexible electronics adhesive that permanently seals sensor housings airtight and reliably protects components such as image sensors. DELO DUALBOND BS3770 satisfies the stringent demands of the semiconductor and automotiv

DELO | 23-10-2023

TDK Corporation has expanded its Micronas direct-angle Hall-effect sensor family portfolio with the new HAL 3927 sensor for automotive and industrial applications. The sensor features a linear, ratiometric analog output with integrated wire

TDK | 23-10-2023

Anritsu Company announces enhanced functionality to the Field Master spectrum analyser LTE and 5G measurement options. As the rollout and densification of 5G networks accelerates, degradation of network performance resulting from interferen

Anritsu | 18-10-2023