Parker Hannifin has launched four groundbreaking series of thermal management solutions: NSAC, NSEC, and NSIC cartridge quick disconnect couplers, alongside the NSSC screw-to-connect couplers. These innovative products are created to satisf

Parker Hannifin plc | 07-11-2024

The Chomerics Division of Parker Hannifin Corporation presents a trio of new thermal interface materials at Electronica 2024. Innovations on show will include new thermal cure-in-place, gap pad and dispensable gel products. The company is a

Parker Chomerics | 05-11-2024

Fluke Corporation has launched the iSee Mobile Thermal Camera, a pocket-sized, portable thermal camera with the resolution to provide detailed image quality comparable to professional cameras, with full temperature range analysis. The camer

Fluke | 29-10-2024

Power supply designers for AI servers face considerable thermal challenges. Because of the size constraints for AI server rooms, many methods of heat reduction are impractical, need complex implementation, or are costly. Thermal jumpers pro

Stackpole | 28-10-2024

The Sensirion STS4L is the latest addition to the STS4x temperature sensor series and is an excellent solution for cost and space-sensitive applications. With adapted accuracy specifications, it provides top performance and industry-leading

Sensirion | 28-10-2024

Molex has introduced a thermal management solution that decreases the time and cost of deploying and upgrading high-performance data centres to meet unrelenting demand for generative AI and machine learning workflows. Molex VaporConnect Opt

Molex | 27-09-2024

Helvar has announced the official commercial launch of Helvar Senses, an advanced environmental sensing solution integrated into lighting controls. Building on insights gained from pilot projects across diverse industries, including success

Helvar | 04-09-2024

Master Bond EP21ARHTND-2 is a two-part epoxy adhesive developed to withstand prolonged chemical exposure. "The system's chemical resistance was successfully tested in chemicals such as 98% sulphuric acid, 25% hydrochloric acid, 20% phosphor

Masterbond | 19-08-2024

The Chomerics Division of Parker Hannifin Corporation has released its new THERM-A-GAP PAD 30 thermally conductive gap filler pads, a high-performance solution for EV battery packs that fits seamlessly into robotic assembly processes typica

Parker Chomerics | 30-07-2024

Laird Thermal Systems has released a new high-performance thermoelectric cooler assembly series that uses next-generation thermoelectric coolers with advanced semiconductor materials. This enhancement boosts cooling performance by up to 10%

Laird | 11-06-2024

Power Integrations has launched the SCALE-iFlex XLT family of dual-channel plug-and-play gate drivers for operation of single LV100 (Mitsubishi), XHP 2 (Infineon), HPnC (Fuji Electric) and equivalent semiconductor modules up to 2300V blocki

Power Integrations | 30-05-2024

Power supply designers, grappling with thermal challenges as power levels surge, often find traditional heat reduction methods impractical due to size, layout, or cost constraints. The TMJ series, with its compact size and cost-effectivenes

Stackpole | 20-05-2024

CUI Devices’ Thermal Management Group has announced the expansion of its BGA heat sinks line. Compatible with BGA devices, the HSB family now offers aluminium or copper material options, clean or black anodised material finishes, and adhesi

CUI Devices | 14-05-2024

FLIR, a Teledyne Technologies company, has released the FLIR CM276 professional clamp meter with infrared imaging, a visual camera, and solar PV DC built for electrical test and measurement. The device empowers electrical professionals to t

Teledyne FLIR | 05-03-2024